ADM-PCIE-KU3 - High-Performance Data Processing


Photo 1 of adm-pcie-ku3Photo 2 of adm-pcie-ku3Photo 3 of adm-pcie-ku3Photo 4 of adm-pcie-ku3Photo 5 of adm-pcie-ku3Main Photo of adm-pcie-ku3  Board: Kintex UltraScale PCIE SDRAM Fast I/O : Commercial Data Center Board Kintex UltraSCALE

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ADM-PCIE-KU3 Documents

Datasheet (pdf)

User Manual v1.13 (pdf)

Xilinx Vivado Board Files

The board files for the ADM-PCIE-KU3 are available for Vivado 2018.1

Download Vivado Board Files here (Vivado version 2018.1)

OpenPOWER Ready

The ADM-PCIE-KU3 has been certified as OpenPOWER Ready.

CAPI Connectivity

The ADM-PCIE-KU3 is CAPI 1.0 compliant and compatible with Power8 systems.

The CAPI suport files can be downloded from the CAPI Support Website.


The ADM-PCIE-KU3 is compatible with CAPI SNAP Framework.

Further details of the Framework can be found on the CAPI SNAP web pages.

Support and Development Kit

The contents of the SDK can be viewed in


Please contact Alpha Data for details on the purchase of the ADM-PCIE-KU3 SDK.

Associated Documentation


Declaration of Conformity

ADM-PCIE-KU3 Declaration of Conformity.

Product Notice



  • High-Performance Data Processing
  • Data Center
  • Network Accelerator
  • High Performance Computing (HPC)
  • System Modeling
  • Market Analysis

Board Features

  • 2x QSFP+ Cages
  • 2x SATA Interfaces
  • System Monitor
  • Heatsink with optional fan

FPGA Features (Hard IP)

  • 3x PCI Express Gen3 cores


The ADM-PCIE-KU3 is a high performance reconfigurable Half-Length, low profile x16 PCIe form factor board based on the Xilinx Kintex UltraScale range of Platform FPGAs.

The ADM-PCIE-KU3 features two independent channels of DDR3 memory capable of 1600MT/s (fitted with two 8GB SODIMMs), SATA connections, High Speed I/O via Dual QSFP+ ports supporting up to 40G Ethernet or 4 x 10G Ethernet links, voltage/temperature/current control and monitoring, air-cooled heat sink with removable fan. Please contact Alpha Data Sales for no-fan ordering option.

Board Format

1/2 Length, low profile, x16 PCI Express Card

Width: 174mm Height: 68.9mm Depth: 32.5mm Weight: 220g

Environmental Specifications

Temperature Limits:

Operating Temperature range: 0°C to +55°C

Storage Temperature range: -40°C to +85°C

Operating Humidity range: Up to 95% (non-condensing)

Host I/F

PCI Express® Gen3 x8 (also supports 2nd x8 PCIE hard macro or soft x16 cores)

Target Device

Xilinx Kintex® UltraScale™

XCKU060-2 - FFVA1156

FPGA Resources


FPGA Hard IP Cores

  • 3x PCI Express Gen3 cores

On Board Memory

Memory TypeNo. BanksMemory Size
(per bank)
ECC-SODIMMs21G x 72 (8GiB)

System Monitor

All power rails are sequenced and monitored by a TI Fusion IC. The TI Fusion controller monitors certain voltage readings, current readings, and Power OK signals to determine the state of the system. A PC can directly interact with the TI Fusion IC via the onboard PMBUS interface.

FPGA Configuration

  • From onboard Flash
  • Over JTAG

FPGA Configuration Flash

Flash TypeFlash SizeNo. config regions
BPI1GBit4 each of 256MBit

High-Speed Network Interfaces

Interface TypeQtyLanes per InterfaceData Rate per LaneProtocol Capability
QSFP2410GbpsUser Configurable, includes 10/40G Ethernet

Other I/O Interfaces

Dual SATA Interfaces (6Gbps)

External Sync (PPS) interface


Reference Design Package available separately

Ordering Information
ParametercodeParameter Description
Memory OptionM

blank = 16GB,
/32GB = 32GB

Fan FittedF

blank = Fan Fitted,
/NF = No Fan Fitted


  • ADM-PCIE-KU3 Board
  • One Year Warranty
  • One Year Technical Support
  • Xilinx Vivado Board Files

Sales Questions

For any sales questions regarding the ADM-PCIE-KU3, please e-mail us at:

Technical Support

For any technical questions regarding Alpha-Data products please e-mail us at:

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