Summary

The ADM-VB630 is a 3U Space VPX platform featuring the AMD Versal AI Edge XQRVE2302 Adaptable SoC for Space 2.0 applications. This FPGA processor card is available in either a 160 mm or 220 mm deep Space VPX form factor, equipped with Space Grade DDR4 Memory modules from Teledyne e2v and a fully radiation-tolerant core power supply developed in collaboration with TI and EPC Space.

The platform is designed to accomodate components suitable for Space 2.0 level missions with limited radiation exposure or mission length, such as LEO applications. The /DEV version is for development purposes and fitted with commercial/ no-flight components. Fully radiation-tolerant and space flight versions are available (contact sales for details.)

Applications

COTS Development for Space 2.0
COTS Deployment for Space 2.0
In-Orbit Reconfigurable Compute
High Performance Signal and Image Processing
Input/Output Intensive Single Board Computer (SBC)
Advanced Communications
Machine Learning and AI

Board Features

Fully radiation-tolerant reference design
Versal VE2302 SoC for Space 2.0
Reference full radiation-tolerant Power Supply using SEP grade parts from TI and GaN FETs from EPC Space
3U Space VPX form factor (160 mm deep or 220 mm deep heat sink)
8x 16G HSSIO via P1 Interface
Teledyne e2v Space Grade DDR4 Memory
Rad-hard watchdog

FPGA Features (Hard IP)

34x AI Engine-ML Tiles
2x ARM Cortex-A72 MPCores™
2x ARM Cortex-R5 MPCores

Specification

Board Format

3U VPX
Width: 100 mm
Height: 19.55 mm
Depth: 160 mm
Weight: TBD g

Environmental Specifications

Temperature Limits
Operating Temperature RangeStorage Temperature Range
MinMaxMinMax
AC0Air Cooled Commercial0°C+55°C-40°C+85°C

Operating Humidity Range:
Up to 95% (non-condensing)


Host I/F

n/a


Target Device

AMD Versal AI EDGE
XCVE2302-1MSESFVA784 (development units), XQRVE2302-1MSBVSVA784 (flight units) (option)

FPGA Resources

Chosen DeviceLUTsDSPsBRAMURAM
XCVE2302-1MSESFVA784 (development units)150K4645.4Mb43.6Mb
XQRVE2302-1MSBVSVA784 (flight units)150K4645.4Mb43.6Mb

FPGA Hard IP Cores

34x AI Engine-ML Tiles
2x ARM Cortex-A72 MPCores™
2x ARM Cortex-R5 MPCores

On Board Memory

Memory TypeNo. BanksMemory Size (per bank)
MCP18 GB (1G @ 72 bit wide) DDR4

Target FPGA Configuration

Via QSPI daughter module, uSD and via JTAG


FPGA Configuration Flash

Flash TypeFlash Size
QSPI MRAM or Flash - on daughter module2 Gb

I/O Interfaces

Interface TypeQtyDescription
BACKPLANE I/O (VPX Backplane)
VPX P0 I2C1I2C for System Monitor inside Versal
VPX P1 HSSIO88x HSSIO up to 16G: for 10/40G Ethernet; SpaceFibre; PCIe; JESD204; Aurora; HSDP etc.
VPX P1 SpaceWire22x SpaceWire Interfaces
VPX P1 MIO1616 MIO pins for RTM Ethernet PHY or general purpose I/O (GPIO)
VPX P2 GPIO7272 Custom GPIO breakout to backplane (2.5V or 3.3V)

Ordering Information

Ordering Code
ADM-VB630(T)
ParameterCodeParameter Description
Platform TypeT/DEV - ADM-VB630/DEV/PB - with XCVE2302 fitted, purchasable as part of ADK-VB630 Development Kit,
/FM - build to order with Space Qualified Components,
/C(x) - build to order with Customer Specific Modifications

Resources:

Support

Please visit the ADK-VB630 product page for details on resources supplied for the ADM-VB630.

Sales Questions

Sales Questions

For any sales questions please e-mail us at [email protected]

Sales Questions

Technical Support

For any technical questions please e-mail us at [email protected]

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