ADM-VPX3-9Z5

Summary
Specification
Ordering Information
Related Products
Resources

Summary

The ADM-VPX3-9Z5 is an OpenVPX MPSoC FPGA System on Module (SoM) utilizing the AMD Zynq UltraScale+ XQZU19EG M-temp device. The ADM-VPX3-9Z5 has been developed in partnership with AMD and Texas Instruments and features Mil-temp range (-55C to +125C) board components throughout for reliability. The ADM-VPX3-9Z5 is suitable for high-altitude applications and is compliant with LVAUX mode for Single Event Effects (SEE) mitigation.
The Open Group Sensor Open Systems Architecture™ influenced the development of this board and the ADM-VPX3-9Z5 is aligned with the SOSA™ Technical Standard.

The ADM-VPX3-9Z5 provides flexible IO via an FMC+ Site and via the VPX backplane, dual 8GB DDR4-2400 SDRAM (PL and PS), 1Gb QSPI configuration Flash, System Monitoring and Mil-temp enhanced products for Power and Temperature Sensing solutions from Texas Instruments.

Applications

Embedded Systems requiring Mil-Temp AMD XQ Zynq UltraScale+ MPSOC
High Altitude Sensor Processing
Harsh SWaP limited Environments

Board Features

Compliant with AMD LVAUX mode for XQ UltraScale+
Complete Mil-temp enhanced products for power management & signal conditioning
FMC+ HPC Interface

FPGA Features (Hard IP)

4x Arm® Cortex™-A53 MPCore™
2x Arm Cortex-R5 MPCore
1x Arm Mali™-400 MP2
5x PCI Express Gen3 x16 cores
4x 100G Ethernet MAC/PCS with RS-FEC

Specification

Board Format

3U VPX (OpenVPX Compliant)

Environmental Specifications

Temperature Limits

		Operating Temperature Range		Storage Temperature Range
		Min	Max	Min	Max
MIL	MIL Operating Temperatures	-55°C	+105°C	-60°C	+150°C
IND	Industrial	-40°C	+85°C	-55°C	+125°C

Operating Humidity Range:
Up to 95% (non-condensing)

Host I/F

Host System Controller Capable
PCI Express (PS or PL)
10Gigabit Ethernet

Target Device

AMD Zynq® UltraScale+ MPSoC
XQZU19EG-1 (FFRC1760M)

FPGA Resources

Chosen Device	FFs	LUTs	DSPs	BRAM	URAM
XQZU19EG-1	1045k	523k	1968	34.6Mb	36Mb

FPGA Hard IP Cores

4x Arm® Cortex™-A53 MPCore™
2x Arm Cortex-R5 MPCore
1x Arm Mali™-400 MP2
5x PCI Express Gen3 x16 cores
4x 100G Ethernet MAC/PCS with RS-FEC

On Board Memory

Memory Type	No. Banks	Memory Size (per bank)
Multi-Chip Memory	1	PS - 1G x 72 (8GiB) DDR4-2400
Multi-Chip Memory	1	PL - 1G x 72 (8GiB) DDR4-2400

Target FPGA Configuration

Flexible boot options from on-board SPI Flash

FPGA Configuration Flash

Flash Type	Flash Size
QSPI	2x 512Mb

I/O Interfaces

Interface Type	Qty	Description
ON-BOARD I/O (FMC+ Socket)
FMC+ HPC Interface	24	HSSIO
FMC+ HPC Interface	160/80	Single Ended/Differential Pair I/O
ON-BOARD I/O (VPX P1)
OpenVPX Interface	8	HSSIO (P1)
ON-BOARD I/O (VPX P2)
OpenVPX Interface	16	HSSIO (P2)

Ordering Information

Ordering Code
ADM-VPX3-9Z5(T)
Parameter	Code	Parameter Description
Configuration Type	T	/CC4/PB = Fitted with XQZU19EG-1M, Q Grade FPGA, Conduction Cooled MIL temp, Tin/Lead Solder, /Z19-2/CC3/PB = Fitted with XQZU19EG-2I, Q Grade FPGA, Conduction Cooled IND temp, Tin/Lead Solder

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